Resonac Materials Malaysia Sdn. Bhd.
Product / Service We Provide
Nature of Business
Manufacturing and marketing of epoxy molding compounds.
Company Registration No.
198901000420 (177726-A)
Year Established
1989
Paid Up Capital
- $12,667,000 USD
Key Persons
Managing Director - Dai Kawasaki
Main Shareholders / Parent Company
- Resonac Corporation
-
No. 2 Persiaran Budiman, Seksyen 23Shah Alam, Selangor, 40300, Malaysia
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+603 55417733
-
+603 55417858
Distributor Required
Partnership Required
Looking to Sell
Looking to Buy
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