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Nippon Micrometal Malaysia Sdn. Bhd.

Product / Service We Provide

Nature of Business

Manufacturing and sale of Au bonding wire, Cu bonding wire and micro solder ball.

Company Registration No.

201201032587 (1017075-U)

Year Established

2012

Key Persons

Director - Tadahiro Fukaya
Manager - Jason Koh

Company Background

Nippon Micrometal Malaysia Sdn. Bhd. is an overseas subsidiary of Nippon Micrometal Corporation based in Malaysia, specialising in the manufacturing and sale of Au bonding Wire, Cu bonding wire and micro solder ball.

Main Shareholders / Parent Company

  • Nippon Micrometal Corporation
  • 18-16 Menara Mutiara Sentral, No 2, Jalan Desa Aman 1 Cheras Business Centre
    Kuala Lumpur, Kuala Lumpur, 56000, Malaysia
  • +603 28562694
  • Distributor Required
  • Partnership Required
  • Looking to Sell
  • Looking to Buy